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SMTA International 2022
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Popular Events
#1
IRR1: Continuing the Pb-free Transition in High Reliability Electronics
#2
Registration Opens
#3
IRR3 - Mixed Metallurgy
#4
Monster Mash Bash
#5
PDC2: Defeating Defects in Electronic Assembly
#6
IRR2 - Modeling
#7
MD2
#8
PDC5: Reflow Profiling Simplified
#9
MD1
#10
PDC1: Cleaning and Cleanliness Testing Best Practices
#11
IRR4 - Mechanical Testing
#12
HPR2: Thermo-Reliability of Solder Joints
#13
IRR7 - High Reliability 2
#14
IRR6 - High Reliability 1
#15
TI2 - Printed Electronics; Challenges and Opportunities Panel Discussion
#16
IRR5 - Microstructure
#17
PDC4: Reliability Testing and Design for Reliability of Lead-Free Solder Joints
#18
HPR1: Conformal Coating
#19
MD3
#20
Women's Leadership Connection Reception
#21
APT1 - High Density Packaging
#22
APT2 - High Performance Packaging 1
#23
TI1 - Digital Factory and Artificial Intelligence
#24
Women's Leadership Program: Invited Presentations
#25
Women's Leadership Program: Speed Mentoring Sessions
#26
Registration Opens
#27
Electronics Exhibition
#28
SMTA Annual Meeting
#29
LTS1 - Electromigration
#30
Keynote Presentation: The Electric Vehicle (EV) Conundrum
#31
MFX1 - Printing Optimization Ops Excellence
#32
MFX 2-1 - Cleaning
#33
INS1-Measurement, Metrology, and Testability
#34
INS2 - Xray and CT Inspection Techniques for PCBAs
#35
MFX 2-2 - Cleaning Process
#36
LTS2 - Testing & Quality
#37
Passport to the World of SMT - Kick Off Meeting
#38
Growing the Future II: NextGen Electronic Manufacturing Workforce - Panel Discussion
#39
MFX4 - Reflow & Soldering Challenges
#40
MFX3 - Printing Challenges
#41
LTS3 - Materials Innovations
#42
LTS5 - Thermal Cycling 2
#43
MFX5 - Smart Factory & Automation
#44
Electronics Exhibition
#45
LTS6 - Thermal Mechanical Reliability
#46
MAT1 - Solder Plating and Finishes
#47
LTS4 - Thermal Cycling 1
#48
MAT3 - Soldering and Component Attachment
#49
MAT 2 - Conformal Coating
#50
MAT4: Solder Pastes - Improving Voiding, Power and Reinforcement of Applications
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