Chair: Charles Bauer, Ph.D., TechLead Co-Chair: Ian Tevis, Ph.D., Safi-Tech
>> Low Temperature Solder Hybrid Solder Joint Time Dependent Behavior Learnings Speaker: Hemant Shah, Ph.D., Intel Corporation
>> Thermal Reliability of Mixing Bismuth-Containing Solder Paste with SAC BGAs At Low Reflow Temperatures - Part III Speaker: Wenjing He, Rochester Institute of Technology
>> Reliability Performance of SMT Low Temperature Solder Second Level Interconnects Speakers: Jason Stafford, Kevin Byrd, Intel Corporation
