Chair: Kevin Byrd, Intel Corporation Co-Chair: Srinivas Chada, Project Kuiper
>> The Thermal Cycling Performance of Hybrid Low Temperature Solder Joints Assembled at Different Peak Reflow Temperatures Speaker: Richard Coyle, Ph.D., Nokia Bell Labs
>> Reliability Performance of Fourth Generation Low Temperature Solder Alloys in Homogeneous and Hybrid Solder Joints Speaker: Morgana Ribas, Ph.D., MacDermid Alpha Electronics Solutions
>> Reliability of Epoxy-contained Hybrid SnAgCu/SnBiAg Solder Joint Under Thermal Cycling Test Speaker: Watson Tseng, Shenmao America, Inc.
