Chair: Srini Chada, Project Kuiper Co-Chair: Aileen Allen, Insight Global
>> Low Melting Temperature Solder Interconnect Thermal Cycling Performance Enhancement Using Elemental Tuning Speaker: Tae-Kyu Lee, Ph.D., Cisco Systems
>> Thermal Cycling Performance of Hybrid, Homogeneous, and Resin Reinforced Low Temperature Solder Ball Grid Array Interconnects Speaker: Richard Coyle, Ph.D., Nokia Bell Labs
>> The Effect of Thermal Cycling Profile on Thermal Fatigue Performance of a 192-Pin Chip Array BGA with Hybrid, Homogeneous, and Resin Reinforced Low Temperature Solder Interconnects Speaker: Dan Burkholder, Intel Corporation
