>> Functional System Observations of Tin-Bismuth Low Temperature Solder Electromigration Behavior Speaker: Kevin Byrd, Intel Corporation
>> Finite Element Analysis of Electromigration Effect on Solder Ball Performance Speaker: Mehdi Hamid, IBM Corporation
>> Kinetics of the Accumulation of a Layer of Bismuth at the Anode of a Sn-Bi Based Solder Joint During Current Stressing Speaker: Eric Cotts, Ph.D., Binghamton University
