Chair: Mike Bixenman, MBA, DBA, KYZEN Corporation Co-Chair: Robert Kinyanjui, Ph.D., John Deere Electronics Solutions
>> Reliability of Different Solder Joint Alloys in Thermal Cycling and Drop Shock Tests Speaker: Sa'd Hamasha, Ph.D., Auburn University
>> Effect of Matte-Sn Electroplating Parameters on the Thermo-mechanical Reliability of Lead-free Solder Joints Speaker: Abhilaash Ajith Kumar, Ph.D., Robert Bosch GmbH
>> Combined Alloy and Flux Approach toward Cost-Effective High Reliable Solder Joints for Automotive Applications Speaker: Stefan Merlau, James Wertin, Heraeus Deutschland GmbH
